Effect of Nanotopography in Direct Wafer Bonding: Modeling and Measurements
نویسندگان
چکیده
منابع مشابه
Effect of Wafer Bow and Etch Patterns in Direct Wafer Bonding
Direct wafer bonding has been identified as an enabling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need to understand the factors that lead to bonding failure. Bonding relies on shortranged surface forces, thus flatness deviations of the wafers may prevent bonding. Bonding succe...
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Direct wafer bonding is a method for fabricating advanced substrates for microelectromechanical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer. SOI wafers offer many advantages over conventional silicon wafers. In IC technology, the switching speed of circuits fabricated on SOI is increased by 20-50% co...
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ژورنال
عنوان ژورنال: IEEE Transactions on Semiconductor Manufacturing
سال: 2005
ISSN: 0894-6507
DOI: 10.1109/tsm.2005.845009